Smart Manufacturing
The project supports some of the companies within the SINFONET network in using high value services, assistance, orientation, coaching, information, and export promotion to promote not only their individual companies but also the overall foundry supply chain.
The project involves market analysis and technological scouting in the field of innovative cast irons. The partners identified some internationally important trade fairs (Euroguss in Nuremberg, Samumetal in Pordenone, Elmia Subcontractor in Jönköping) at which several marketing activities were conducted to promote and illustrate the Innovative Network and the foundry supply chain (hosting a stand, creation of a "SINFONET path", arranging dedicated seminars).
To support the internationalization of the network through the development and use of shared tools and methodologies.
EnginSoft coordinated the kick-off meeting, and the marketing activity plan, and participated in the EUROGUSS trade fair, the biggest international fair for Die Casting and Die Casting Processes.
EnginSoft | SAEN | LPM | Tecnolabor | Zanardi Fonderie
Funding Scheme POR - Obiettivo "Investimenti a favore della crescita e dell'occupazione" - Parte FESR fondo europeo di sviluppo regionale 2014 - 2020 | ERDF EUROPEAN DEVELOPMENT FUND 2014 - 2020
9 months
October 2017 - July 2018
RIR SINFONET
Nicola Gramegna
5
Some of our competences in research and technology transfer

Research project
The GAP Project’s innovativeness lies in the development of innovative metallic materials with multi-sector application potential, increased by experimentation with new specific technologies (e.g. the use of ceramic cores for die-casting, surface treatments, and joining techniques).

Research project
The main specific objective of SPACE is to enable the most widely used European A&C HPC codes (which are also among the most widely used worldwide) to efficiently and effectively exploit the pre-exascale systems funded by EuroHPC Joint Undertaking and available at the end of 2022, and to prepare them for the transition to exascale and beyond.