This technical article presents a simulation process to analyze fatigue in electronic parts, particularly in solder joints, on printed circuit boards (PCBs).
There are three core technologies in the process:
By applying a single frequency response analysis to the FE model of an electronic component containing the substitute FE models, and conducting static analyses of all the solder-joint sub-models, the vibrational solder-joint fatigue can be efficiently calculated in FEMFAT spectral, where the section forces in the pins of the electronic devices are mapped onto the sub-models and scaled by a power spectral density to calculate the damage in all solder joints.
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CASE STUDY
Fatigue design of large welded structures presents significant challenges due to complex geometries and variable loading conditions, especially in industries such as offshore engineering. While nominal stress-based methods remain widely used, they often fall short when applied to intricate welded details. This study investigates the use of MAGNA FEMFAT, a commercial fatigue analysis tool, to evaluate the fatigue strength of large welded K-nodes typically found in small offshore platforms.
marine femfat
