Introduction of multiscale analysis techniques to accelerate PCB design

Date: 30 November 2022

Timetable: 11:00 CET

Speakers: Koji Yamamoto

Language: English

Koji Yamamoto

Many materials with heterogeneous microstructures are used in Printed Circuit Board (PCB). By controlling the microstructure of such composite materials, the properties can be created to match various design requirements. For example, the linear expansion coefficient of sealing resins can be controlled by mixing the appropriate amount of filler. This reduces thermal stress between neighboring materials and increases product life.

However, because of the high degree of design freedom in this problem, it is not realistic to evaluate material properties solely on actual testing. This presentation will introduce material property prediction techniques based on virtual material testing.


  • Multiscale analysis, Homogenization, virtual material testing, Printed circuit board;

  • Material design;

  • Filling resins;

  • filler dispersed composites, woven composites.

Material design considering molding history by coupling virtual material testing with molding analysis

Enrolment Methods

The event is free: you need to register to attend.

A Web platform (Zoom) is used, which does not require local software installation.
You can participate in the session via: MAC, PC, or any mobile device.

Upon registration, a link, and credentials to participate will be sent to the e-mail address provided.

You can ask questions and participate in the discussion in the chat room.

Afterwards you will be able to watch the recording of this webinar, and our other initiatives, by visiting the Media Center on our website or our YouTube channel.

2022, 30th November | Hour: 11:00 CET

Enjoy the initiative!


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