online webinar

ANSYS Icepak and Sherlock For Temperature Cycling

Date: 24 Marzo 2020

Timetable: 18.00 - 19.00

Speakers: ANSYS Webinar

Language: English

Temperature cycling of printed circuit boards can cause failures due to solder fatigue. This is a thermomechanical process that happens due to a mismatch in the coefficients of thermal expansion (CTEs) between the PCB and the components. Too often, the thermal and mechanical simulations are done separately: Thermal engineers perform the CFD analysis in ANSYS Icepack after the mechanical reliability team has finished with the model.

This webinar will demonstrate an automated process of thermal modeling of printed circuit boards. It will present a workflow to translate ECAD data to a thermal and mechanical model in ANSYS Icepack, followed by the transfer of results into ANSYS Sherlock for solder fatigue analysis.

Evento organizzato da:

ansys

MODALITÀ DI ISCRIZIONE

Compila il modulo e partecipa al Webinar

Find out more:

software

ANSYS

Explore Pervasive Engineering Simulation

ANSYS offers a comprehensive software suite that spans the entire range of physics, providing access to virtually any field of engineering simulation that a design process requires

ansys

Read More  

NEWSROOM

Stay connected with our news, analysis and trends from our experts

 

Read More  

MEDIA CENTER

Scroll through our Media Center to view all the videos, video-tutorials and recorded webinars

Media Center  

CASE STUDY

Advanced strategies for the flow field optimization of a medical device

How to use a hybrid method of CFD analysis for product optimization and performance improvement while reducing the computational effort and the time required to achieve the results

Further reduction of the heat loss compared to the best design of the NSGA-II first phase design optimization: a further 4% gained

cfd biomechanics ansys modefrontier optimization

Read More